Molex Corporation first unveiled the MediSpec Molding Interconnect/Digital Direct Molding (MID/LDS) product to meet the requirements of innovative 3D technology development, combining advanced MID technology with LDS antenna expertise in a single form factor An integrated small pitch 3D circuit is available in the package, making it ideal for high-density medical devices and meeting the strict guidelines of the medical class.
Steve Zeilinger, group product manager at Molex, said: "The MediSpec MID/LDS 3D protection circuit outperforms existing 2D technology, allowing medical device designers to integrate highly complex electrical and mechanical functions into extremely compact applications."
The patented MediSpec MID/LDS 3D technology emphasizes functionality, space, weight and cost savings, combining the high flexibility of MID's injection molding process with the speed and precision of LDS. LDS can be extended from small batches to large batches, using 3D lasers to image micro-segment electronic circuits on a variety of RoHS-compliant molded plastics, enabling pattern modifications to use lines down to 0.10 mm And space, while the circuit pitch can be used down to 0.35 mm.
Molex has extensive experience in design and manufacturing, customizing the MediSpec MID/LDS select tracking solution with miniaturized connectors, circuit paths, switch pads, sensors, and even antennas. Integrated chips, capacitors and inductors are suitable for SMT applications and meet specific mechanical requirements for direct soldering to local plating on plastics that meet RoHS requirements. Insert and attachment molding technology enables built-in functionality that reduces weight and improves functionality.
Zeilinger added: "Our MediSpec 3D interconnect package is an excellent selling point for miniaturization strategies, saving significant space compared to traditional PCB and flexible circuit designs. MID/LDS technology in the medical industry The strength to emphasize miniaturization, convergence and medical trends is unparalleled."
The MediSpec MID/LDS 3D package is ideal for blood glucose meters, home medical telemetry, catheter interfaces, blood oxygen saturation sensors, hearing aids, and many other medical device applications. In addition to full engineering support, Molex also offers MID/LDS quality control testing to ensure compliance with product reliability and performance standards.
Sodium Tert-butoxide CAS No.865-48-5
Sodium Tert-butoxide Chemical Information
Density 1,104 g/cm3
Boiling Point 180°C/1mmHg
Melting Point 180 °C
Molecular Formula C4H9NaO
Molecular Weight 96.103
Flash Point 12°C
Storage condition Flammables area
Water Solubility reacts
Sodium Tert-butoxide Structure
Sodium Tert-butoxide Application
1. Used as an intermediate for organic synthesis and Pharmaceutical Intermediates
2. As a strong base, it is widely used in the condensation, rearrangement and ring opening reactions in organic synthesis such as chemical, pharmaceutical and pesticide.
Sodium Tert-Butoxide,Sodium Tert Butoxide Cas No,Sodium Tert Butoxide Synthesis,Sodium Tert-Butoxide Mechanism
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